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LEADER |
00844nmm a2200169 u 4500 |
001 |
EB000308019 |
003 |
EBX01000000000000000106872 |
005 |
00000000000000.0 |
007 |
cr||||||||||||||||||||| |
008 |
110826 ||| |
020 |
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|a 0780372204
|
245 |
0 |
0 |
|a First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
|h Elektronische Ressource
|
260 |
|
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|a New York
|b The Institute of Electrical and Electronics Engineers, Inc.
|c 2001
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653 |
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|a Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Components, Circuits, Devices and Systems
|
989 |
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|b IEEEPROC
|a IEEE Conference Proceedings
|
856 |
4 |
0 |
|u https://ieeexplore.ieee.org/servlet/opac?punumber=7679
|x Verlag
|3 Volltext
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082 |
0 |
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|a 600
|