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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2001
Subjects:
Engineered Materials, Dielectrics And Plasmas; Photonics And Electrooptics; Components, Circuits, Devices And Systems
Online Access:
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
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