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by Jablonski, Stefan, Petrov, Ilia, Meiler, Christian, Mayer, Udo
Published 2004
“... and many more with respect to platform, architectural layer, and application package, and guide the reader...”Published 2004
Springer Berlin Heidelberg
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by Robinson, David G., Ehlers, Ulrich, Herken, Rainer, Herrmann, Bernd
Published 1987
“... were no longer appli cable, since even the thinnest paraffin layers could not be penetrated...”Published 1987
Springer Berlin Heidelberg