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1
by Tietze, U., Schenk, C.
Published 1978
Springer Berlin Heidelberg
Table of Contents: “... -- 2 Controlled sources and impedance converters -- 2.1 Voltage-controlled voltage sources -- 2.2...”
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2
Published 1989
Springer Netherlands
Table of Contents: “... Introduction -- 2.2 EPI Equipment -- 2.3 Deposition -- 2.4 Doping -- 2.5 Autodoping -- 2.6 Pattern Shift -- 2.7...”
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3
Published 2015
Springer India
Table of Contents: “... Multiplier and design of DSP operations using Vedic Sutra -- Part 7_Advances in Signal Processing: Chapter 50...”
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4
by Tong, Xingcun Colin
Published 2011
Springer New York
Table of Contents: “... Thermal management solutions -- 1.5 Design for advanced thermal management of electronic packaging -- 1.6...”
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5
Published 1997
Springer Netherlands
Table of Contents: “... Transport in Quantum Well Semiconductors -- 2.2. Integrated Optoelectronics — the Next Technological...”
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6
Published 2000
Springer Netherlands
Table of Contents: “... and Josephson Junction Circuits -- VIII Nano-Electronics -- 30 Recent Advances in Nanotechnology: An Overview...”
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7
Published 2009
Springer Netherlands
Table of Contents: “... -- Microelectronics-Based Biosensors for the Detection of Proteins and Nucleic Acids -- Bionano-Microbiology...”
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8
Published 1980
Springer Berlin Heidelberg
Table of Contents: “... Device Fundamentals -- 2.1 Fundamentals of VLSI Device Improvements -- 2.2 Problem Areas for VLSIC’s...”
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9
Published 1994
Springer Berlin Heidelberg
Table of Contents: “... Polarization Behavior of Different Radar Objects -- 2.2 Some Implementation Aspects -- 2.3 Optimum Radar...”
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10
Published 1985
Springer Berlin Heidelberg
Table of Contents: “... of an Optical Beam by a Second Optical Beam in Biased Semi-Insulating GaAs. (With 6 Figures) -- 22-GHz Bandwidth...”
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11
Published 1995
Springer US
Table of Contents: “...1. Acoustic Microscopy Analysis of Microelectronic Interconnection and Packaging Technologies...”
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12
Published 1982
Springer Berlin Heidelberg
Table of Contents: “... Device Fundamentals -- 2.1 Fundamentals of VLSI Device Improvements -- 2.2 Problem Areas for VLSIC’s...”
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13
Published 1990
Springer Berlin Heidelberg
Table of Contents: “... Microstructures -- 2.1 Dimensional Confinement and Device Concepts -- 2.2 Molecular Beam Epitaxy -- 2.3...”
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14
by Reisch, Michael
Published 2003
Springer Berlin Heidelberg
Table of Contents: “... -- 2. Semiconductor Physics Required for Bipolar-Transistor Modeling -- 2.1 Band Structure -- 2.2...”
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15
by Nag, B.R.
Published 1980
Springer Berlin Heidelberg
Table of Contents: “... of Interest -- 1.4 Scope of the Book -- 2. Crystal Structure -- 2.1 Zinc-Blende Structure -- 2.2 Wurtzite...”
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16
Published 1986
Springer Berlin Heidelberg
Table of Contents: “... of the Microfabrication Technology -- 2. Electron Beam Lithography -- 2.1 Background -- 2.2 Components for Electron-Beam...”
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17
Published 1994
Springer Berlin Heidelberg
Table of Contents: “...-Induced Negative Resistance -- 2.2 Injection Mechanisms -- 2.3 Numerical Large-Signal Simulations -- 2.4...”
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18
Published 2003
Springer Berlin Heidelberg
Table of Contents: “... -- 2.2 Thin-Film Material Characterization -- 2.3 General Structure-Property Relationships -- 2.4...”
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19
by Graaff, Henk C. de, Klaassen, Francois M.
Published 1990
Springer Vienna
Table of Contents: “... Concepts -- 2.2 Distribution Function and Carrier Concentration -- 2.3 The Boltzmann Transport Equation...”
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20
by Clara, Martin
Published 2013
Springer Berlin Heidelberg
Table of Contents: “...-Converters -- Advanced Current Calibration...”