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1
by Madenci, Erdogan, Guven, Ibrahim, Kilic, Bahattin
Published 2003
Springer US
Table of Contents: “... Approach -- 2.2 Analysis Steps -- 2.3 Case Study: BGA-Type Package -- 2.4 References -- 3 Mechanical...”
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2
by Way Kuo, Wei-Ting Kary Chien, Taeho Kim
Published 1998
Springer US
Table of Contents: “... -- 2.1 Microelectronics Manufacturing -- 2.2 New Techniques for Reliability Improvement -- 2.3...”
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3
Published 1998
Springer Netherlands
Table of Contents: “... Mechanical Properties of Lead-Tin-Based Alloys -- 2.2 Flip Chip Technology: Is It Time for Mass Production...”
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4
by Pushkar, Jain, Rymaszewski, Eugene J.
Published 2004
Springer US
Table of Contents: “... References -- 2 Design Fundamentals -- 2.1 Breakdown Voltage and Capacitance Density Design Limits -- 2.2...”
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5 Table of Contents: “... Interconnect Projections -- 1.3 Low-? Requirements and Materials -- 1.4 Need for Low-? CMP Process...”
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6
Published 2004
Springer US
Table of Contents: “...4.2.12 Integrated optical circuits fabrication -- 4.3 Gels, Bulk Materials, Fibers and Powders...”
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7
by Beaman, J.J., Barlow, John W., Bourell, D.L., Crawford, R.H.
Published 1997
Springer US
Table of Contents: “... -- References -- 2. Process Methods -- 2.1 Background -- 2.2 Process Techniques -- 2.3 Role of Machining -- 2.4...”
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8
Published 1984
Springer US
Table of Contents: “... for Material Behavior Data -- 12. Computer-Aided Editing—Present and Future -- 13. Applying Optical Mass Memory...”