|
by Chauhan, Preeti S., Choubey, Anupam, Zhong, ZhaoWei, Pecht, Michael G.
Published 2014
Table of Contents:
“...Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal...”Published 2014
Springer New York
|
by Merzouki, Rochdi, Samantaray, Arun Kumar, Pathak, Pushparaj Mani, Ould Bouamama, Belkacem
Published 2013
Table of Contents:
“...1.Elements of Mechatronic Systems -- 2.Bond Graph Modelling of Mechatronic Systems -- 3.Modelling...”Published 2013
Springer London
- 1
- 2