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author_facet:"Wong, C.P."
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1
Materials
for Advanced Packaging
Published 2009
Springer US
Table of Contents:
“
... and Packaging -- LED and
Optical
Device Packaging and
Materials
-- Digital Health and Bio-Medical Packaging...
”
Read Now
2
Materials
for Advanced Packaging
Published 2017
Springer International Publishing
Table of Contents:
“
...-to-Substrate Connections -- Advanced Wire Bonding Technology:
Materials
, Methods, and Testing -- Lead-Free...
”
Read Now
3
Electrical Conductive Adhesives with Nanotechnologies
by
Li, Yi (Grace)
,
Lu, Daniel
,
Wong, C.P.
Published 2010
Springer US
Subjects:
“
...
Optical
Materials
...
”
Read Now
4
Micro- and Opto-Electronic
Materials
and Structures: Physics, Mechanics, Design, Reliability...
Published 2007
Springer US
Table of Contents:
“
... in Application to Photonic
Materials
-- High-Speed Tensile Testing of
Optical
Fibers— New Understanding...
”
Read Now
5
Advanced Flip Chip Packaging
Published 2013
Springer US
Subjects:
“
...
Optical
Materials
...
”
Read Now
6
Nano-Bio- Electronic, Photonic and MEMS Packaging
Published 2010
Springer US
Table of Contents:
“
... Nanomaterials as Electrical Interconnects and Thermal Interface
Materials
-- Nanomaterials via NanoSpray...
”
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Author: Wong, C.P.
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621 - Applied physics
4
620 - Engineering & allied operations
2
Language
English
6
Collection
Springer eBooks 2005-
6
Author
Wong, C.P.
Lu, Daniel
3
Li, Yi (Grace)
2
Lai, Yi-Shao
1
Lee, Y.C.
1
Moon, Kyoung-Sik
1
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Suhir, Ephraim
1
Tong, Ho-Ming
1
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