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1
Published 2009
Springer US
Subjects: “...Electronics and Microelectronics, Instrumentation...”
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2
Published 2010
Springer US
Table of Contents: “...Nanomaterials for Microelectronic and Bio-packaging -- Nano-conductive Adhesives for Nano...”
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3
Published 2013
Springer US
Subjects: “...Electronics and Microelectronics, Instrumentation...”
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4
by Li, Yi (Grace), Lu, Daniel, Wong, C.P.
Published 2010
Springer US
Subjects: “...Electronics and Microelectronics, Instrumentation...”
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5
Published 2017
Springer International Publishing
Subjects: “...Electronics and Microelectronics, Instrumentation...”
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6
Published 2007
Springer US
Table of Contents: “... -- Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods...”