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author_facet:"Wong, C.P."
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1
Materials for Advanced Packaging
Published 2009
Springer US
Subjects:
“
...Electronics and
Microelectronics
, Instrumentation...
”
Read Now
2
Nano-Bio- Electronic, Photonic and MEMS Packaging
Published 2010
Springer US
Table of Contents:
“
...Nanomaterials for
Microelectronic
and Bio-packaging -- Nano-conductive Adhesives for Nano...
”
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3
Advanced Flip Chip Packaging
Published 2013
Springer US
Subjects:
“
...Electronics and
Microelectronics
, Instrumentation...
”
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4
Electrical Conductive Adhesives with Nanotechnologies
by
Li, Yi (Grace)
,
Lu, Daniel
,
Wong, C.P.
Published 2010
Springer US
Subjects:
“
...Electronics and
Microelectronics
, Instrumentation...
”
Read Now
5
Materials for Advanced Packaging
Published 2017
Springer International Publishing
Subjects:
“
...Electronics and
Microelectronics
, Instrumentation...
”
Read Now
6
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging : Volume I Materials Physics - Materials Mechanics. Volume II Physical Desig...
Published 2007
Springer US
Table of Contents:
“
... -- Characterization of Stresses and Strains in
Microelectronics
and Photonics Devices Using Photomechanics Methods...
”
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Author: Wong, C.P.
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621 - Applied physics
4
620 - Engineering & allied operations
2
Language
English
6
Collection
Springer eBooks 2005-
6
Author
Wong, C.P.
Lu, Daniel
3
Li, Yi (Grace)
2
Lai, Yi-Shao
1
Lee, Y.C.
1
Moon, Kyoung-Sik
1
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Suhir, Ephraim
1
Tong, Ho-Ming
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