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author_facet:"Tong, Xingcun Colin"
dewey-ones:"621 - Applied physics"
product_txtF_mv:"Springer eBooks 2005-"
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1
Advanced
Materials
for Thermal Management of Electronic Packaging
by
Tong, Xingcun Colin
Published 2011
Springer New York
Table of Contents:
“
...
Materials
selection for advanced thermal management -- 1.7 Environmental compliance of thermal managing...
”
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