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1
Published 2019
Springer Nature Singapore
Table of Contents: “... materials: A bottom-up approach -- Fracture nanomechanics -- In situ Transmission Electron Microscopy...”
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2
by Chawla, Krishan K.
Published 1993
Springer US
“..., electrical and electronic engineering, etc. can and do participate in the MS&E activities. The need...”
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3
by Chawla, Nikhilesh, Chawla, Krishan K.
Published 2013
Springer New York
“... applications in aerospace, electronic packaging, automotive, and recreational products. This book focuses...”
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4
by Chawla, Nikhilesh, Chawla, Krishan K.
Published 2006
Springer US
“..." materials to several high performance applications in aerospace, electronic packaging, automotive...”