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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses : Fundamental Mechanisms and Application to IC Interconnect Technology

by Borst, Christopher Lyle, Gill, William N., Gutmann, Ronald J.
Published 2002

Springer US

Table of Contents: “... Interconnect Projections -- 1.3 Low-? Requirements and Materials -- 1.4 Need for Low-? CMP Process...”