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| LEADER |
00707nmm a2200181 u 4500 |
| 001 |
EB002161439 |
| 003 |
EBX01000000000000001299515 |
| 005 |
00000000000000.0 |
| 007 |
cr||||||||||||||||||||| |
| 008 |
230519 ||| |
| 020 |
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|a 9781665467957
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| 020 |
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|a 9781665467964
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| 245 |
0 |
0 |
|a 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)
|h Elektronische Ressource
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| 260 |
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|a New York
|b The Institute of Electrical and Electronics Engineers, Inc.
|c 2022
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| 653 |
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|a Engineered Materials, Dielectrics and Plasmas
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| 989 |
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|b IEEEPROC
|a IEEE Conference Proceedings
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| 856 |
4 |
0 |
|u https://ieeexplore.ieee.org/servlet/opac?punumber=9985012
|x Verlag
|3 Volltext
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| 082 |
0 |
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|a 600
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