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210512 ||| eng |
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|a books978-3-03897-415-4
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|a 9783038974154
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|a 9783038974147
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1 |
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|a Ngo, Ha Duong
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245 |
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|a MEMS Accelerometers
|h Elektronische Ressource
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260 |
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|b MDPI - Multidisciplinary Digital Publishing Institute
|c 2019
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300 |
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|a 1 electronic resource (252 p.)
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|a MEMS-IMU
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|a delaying mechanism
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|a MEMS technology
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|a hostile environment
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|a three-axis accelerometer
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|a whispering-gallery-mode
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|a frequency
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|a indoor positioning
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|a MEMS
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|a three-axis acceleration sensor
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|a micromachining
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|a MEMS accelerometer
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|a auto-encoder
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|a probe
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|a n/a
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|a turbulent kinetic energy dissipation rate
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|a heat convection
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|a body sensor network
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|a WiFi-RSSI radio map
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|a field emission
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|a capacitive accelerometer
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|a deep learning
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|a dance classification
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|a History of engineering and technology / bicssc
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|a microelectromechanical systems (MEMS) piezoresistive sensor chip
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|a fault tolerant
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|a wireless
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|a mode splitting
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|a stride length estimation
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|a capacitive transduction
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|a micro machining
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|a cathode tips array
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|a motion analysis
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|a high acceleration sensor
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|a interface ASIC
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|a self-coaching
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|a inertial sensors
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|a classification of horse gaits
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|a performance characterization
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|a process optimization
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|a angular-rate sensing
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|a zero-velocity update
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|a accelerometer
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|a sleep time duration detection
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|a sensitivity
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|a regularity of activity
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|a rehabilitation assessment
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|a L-shaped beam
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|a digital resonator
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|a multi-axis sensing
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|a in situ self-testing
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|a Taguchi method
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|a hybrid integrated
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|a acceleration
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|a electromechanical delta-sigma
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|a miniaturization
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|a vacuum microelectronic
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|a MEMS sensors
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|a low-temperature co-fired ceramic (LTCC)
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|a step detection
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|a wavelet packet
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|a built-in self-test
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|a Kerr noise
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|a piezoresistive effect
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|a activity monitoring
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|a micro-electro-mechanical systems (MEMS)
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|a stereo visual-inertial odometry
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|a optical microresonator
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|a electrostatic stiffness
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|a MEMS-IMU accelerometer
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|a mismatch of parasitic capacitance
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|a gait analysis
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|a safety and arming system
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|a marine environmental monitoring
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700 |
1 |
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|a Rasras, Mahmoud
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700 |
1 |
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|a Elfadel, Ibrahim
|e (Abe) M.
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041 |
0 |
7 |
|a eng
|2 ISO 639-2
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989 |
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|b DOAB
|a Directory of Open Access Books
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500 |
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|a Creative Commons (cc), https://creativecommons.org/licenses/by-nc-nd/4.0/
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|a 10.3390/books978-3-03897-415-4
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856 |
4 |
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|u https://www.mdpi.com/books/pdfview/book/1313
|7 0
|x Verlag
|3 Volltext
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856 |
4 |
2 |
|u https://directory.doabooks.org/handle/20.500.12854/53145
|z DOAB: description of the publication
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|a 900
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|a 800
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|a 363
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|a 333
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|a 600
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|a 620
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|a Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc.
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