Modeling and Application of Flexible Electronics Packaging
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illust...
| Main Authors: | , , |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Singapore
Springer Nature Singapore
2019, 2019
|
| Edition: | 1st ed. 2019 |
| Subjects: | |
| Online Access: | |
| Collection: | Springer eBooks 2005- - Collection details see MPG.ReNa |
Table of Contents:
- Advanced Electronics Packaging
- Interfacial Modeling of Flexible Multilayer Structures
- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy
- Shear-Assisted Peeling
- Single-Needle Peeling
- Multi-Needle Peeling
- Conformal Peeling
- Laser Lift-Off
- Vacuum-Based Picking-up and Placing-on