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181001 ||| eng |
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|a 9783319903620
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| 100 |
1 |
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|a Morris, James E.
|e [editor]
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| 245 |
0 |
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|a Nanopackaging
|h Elektronische Ressource
|b Nanotechnologies and Electronics Packaging
|c edited by James E. Morris
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| 250 |
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|a 2nd ed. 2018
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| 260 |
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|a Cham
|b Springer International Publishing
|c 2018, 2018
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| 300 |
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|a XXVIII, 996 p. 635 illus., 419 illus. in color
|b online resource
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| 505 |
0 |
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|a Nanotechnologies and Electronics Packaging -- Modelling Technologies and Applications -- Advances in Delamination Modeling: Continuum Aspects -- Advances in Delamination Modeling: Atomistic Aspects -- Soft Mold Nano-imprint: Modeling and Simulation -- Nanoparticle Properties -- Nanoparticle Fabrication -- Nanoparticle-based High-k Dielectric Composites for Embedded Capacitors -- Nanostructured Materials for Embedded Resistors -- Nanogranular Magnetic Core Inductors: Design, Fabrication and Packaging -- Nanoparticles in Isotropic Conductive Adhesives -- Nano materials in Anisotropic Conductive Adhesives (ACAs) -- Nanoparticles in Microvias -- Silver Nanoparticles for Inkjet Printed Conductive Structures in Electronic Packaging -- A Study of Nano Particles in SnAg-Based Lead Free Solders -- Nano-Underfills for Fine Pitch Electronics -- Carbon Nanotubes: Synthesis and Characterization -- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications -- High E
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| 653 |
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|a Electrochemistry
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| 653 |
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|a Electrochemistry
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| 653 |
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|a Electronics and Microelectronics, Instrumentation
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| 653 |
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|a Electronics
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| 653 |
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|a Nanotechnology
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| 653 |
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|a Microelectronics
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| 653 |
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|a Nanotechnology
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| 041 |
0 |
7 |
|a eng
|2 ISO 639-2
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| 989 |
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|b Springer
|a Springer eBooks 2005-
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| 856 |
4 |
0 |
|u https://doi.org/10.1007/978-3-319-90362-0?nosfx=y
|x Verlag
|3 Volltext
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| 082 |
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|a 620.115
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| 520 |
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|a This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. Now in a second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. 12 new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging
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