Fundamentals of Lead-Free Solder Interconnect Technology : From Microstructures to Reliability

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Main Authors: Lee, Tae-Kyu, Bieler, Thomas R. (Author), Kim, Choong-Un (Author), Ma, Hongtao (Author)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Boston, MA Springer US 2015, 2015
Subjects:
Online Access:
Collection: Springer eBooks 2005- - Collection details see MPG.ReNa
Table of Contents:
  • The Joint
  • Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys
  • Microstructure Development; Solidification and Isothermal Aging
  • Thermal Cycling Performance
  • Mechanical Stability and Performance
  • Chemical and Environment Attack
  • Challenges in Future Generation Interconnects: Microstructure Again