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Microtransducer CAD Physical and Computational Aspects

Computer-aided-design (CAD) of semiconductor microtransducers is relatively new in contrast to their counterparts in the integrated circuit world. Integrated silicon microtransducers are realized using microfabrication techniques similar to those for standard integrated circuits (ICs). Unlike IC dev...

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Bibliographic Details
Main Authors: Nathan, Arokia, Baltes, Henry (Author)
Format: eBook
Language:English
Published: Vienna Springer Vienna 1999, 1999
Edition:1st ed. 1999
Series:Computational Microelectronics
Subjects:
Electronics And Microelectronics, Instrumentation
Numerical Analysis
Computer Simulation
Computer Modelling
Optical Materials
Electronics
Nanotechnology
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • 6.4 Piezojunction Effect
  • 6.5 Effects of Stress Gradients
  • 6.6 Galvano-Piezo-Magnetic Effects
  • 6.7 The Piezo Drift-Diffusion Transport Model
  • 6.8 Illustrative Simulation Example — Stress Effects on Hall Sensors
  • 6.9 References
  • 7 Mechanical and Fluidic Signals
  • 7.1 Definitions
  • 7.2 Model Equations for Mechanical Analysis
  • 7.3 Model Equations for Analysis of Fluid Transport
  • 7.4 Illustrative Simulation Example — Analysis of Flow Channels
  • 7.5 References
  • 8 Micro-Actuation
  • 8.1 Transduction Principles
  • 8.2 State-of-the-Art and Preview
  • 8.3 Electrostatic Actuation
  • 8.4 Thermal Actuation
  • 8.5 Magnetic Actuation
  • 8.6 Piezoelectric Actuation
  • 8.7 Electroacoustic Transducers
  • 8.8 Computational Procedure and Coupling
  • 8.9 Illustrative Example — CMOS Micromirror
  • 8.10 References
  • 9 Microsystem Simulation
  • 9.1 Electrical Analogues for Mixed-Signals and Historical Developments
  • 9.2 Circuit Modeling and Implementation Considerations
  • 1. Introduction
  • 1.1 Modeling and Simulation of Microtransducers
  • 1.2 Illustrative Example
  • 1.3 Progress in Microtransducer Modeling
  • 1.4 References
  • 2 Basic Electronic Transport
  • 2.1 Poisson’s Equation
  • 2.2 Continuity Equations
  • 2.3 Carrier Transport in Crystalline Materials and Isothermal Behavior
  • 2.4 Electrical Conductivity and Isothermal Behavior in Polycrystalline Materials
  • 2.5 Electrical Conductivity and Isothermal Behavior in Metals
  • 2.6 Boundary and Interface Conditions
  • 2.7 The External Fields — What Do They Influence?
  • 2.8 References
  • 3 Radiation Effects on Carrier Transport
  • 3.1 Reflection and Transmission of Optical Signals
  • 3.2 Modeling Optical Absorption in Intrinsic Semiconductors
  • 3.3 Absorption in Heavily-Doped Semiconductors
  • 3.4 Optical Generation Rate and Quantum Efficiency
  • 3.5 Low Energy Interactions with Insulators and Metals
  • 3.6 High Energy Interactions and Monte Carlo Simulations
  • 9.3 Lumped Analysis: Illustrative Example — Electrostatic Micromirror
  • 9.4 Distributed Analysis: Illustrative Example — Flow Microsensor
  • 9.5 References
  • 3.7 Model Equations for Radiant Sensor Simulation
  • 3.8 Illustrative Simulation Example — Color Sensor
  • 3.9 References
  • 4 Magnetic Field Effects on Carrier Transport
  • 4.1 Galvanomagnetic Transport Equation
  • 4.2 Galvanomagnetic Transport Coefficients
  • 4.3 Equations and Boundary Conditions for Magnetic Sensor Simulation
  • 4.4 Illustrative Simulation Example — Micromachined Magnetic Vector Probe
  • 4.5 References
  • 5 Thermal Non-Uniformity Effects on Carrier Transport
  • 5.1 Non-Isothermal Effects
  • 5.2 Electrothermal Transport Model
  • 5.3 Electrical and Thermal Transport Coefficients
  • 5.4 Electro-Thermo-Magnetic Interactions
  • 5.5 Heat Transfer in Thermal Microstructures
  • 5.6 Summary of Equations and Computational Procedure
  • 5.7 Illustrative Simulation Example — Micro Pirani Gauge
  • 5.8 References
  • 6 Mechanical Effects on CarrierTransport
  • 6.1 Piezoresistive Effect
  • 6.2 Strain and Electron Transport
  • 6.3 Strain and Hole Transport

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