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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss pr...

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Bibliographic Details
Other Authors: Zhang, G.Q. (Editor), Ernst, L.J. (Editor), de Saint Leger, O. (Editor)
Format: eBook
Language:English
Published: New York, NY Springer US 2000, 2000
Edition:1st ed. 2000
Subjects:
Classical Mechanics
Electrical And Electronic Engineering
Machines, Tools, Processes
Electrical Engineering
Manufactures
Control Theory
Systems Theory, Control
Optical Materials
System Theory
Mechanics
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • Simulation overview in the industry
  • Thermal & mechanical problems in microelectronics
  • Solder material characterization and modelling
  • Polymer material characterisation and modeling
  • Generic issues in numerical modeling
  • Modeling of vapor pressure during reflow for electronic packages
  • Simulation for fatigue, cracks and delamination
  • Experimental validation of finite element modeling
  • Perspectives of non-linear simulation
  • Simulation-based optimisation in virtual thermo-mechanical prototyping of electronic packages
  • Thermal fatigue reliability optimisation of Flip-Chip assemblies
  • Product and Process Optimization with simulation

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