Simultaneous Switching Noise of CMOS Devices and Systems

This monograph presents our recent research on Simultaneous Switching Noise (SSN) and related issues for CMOS based systems. Although some SSN related work was previously reported in the literature, it were mainly for Emitter Coupled Logic (ECL) gates using Bipolar Junction Transistors (BJTs). This...

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Bibliographic Details
Main Authors: Senthinathan, Ramesh, Prince, John L. (Author)
Format: eBook
Language:English
Published: New York, NY Springer US 1994, 1994
Edition:1st ed. 1994
Series:The Springer International Series in Engineering and Computer Science
Subjects:
Online Access:
Collection: Springer Book Archives -2004 - Collection details see MPG.ReNa
Table of Contents:
  • 9.2 Equivalent Electrical Circuit Model Formulation
  • 9.3 Calculation of Lumped Circuit Elements
  • 9.4 Transient Response Simulations
  • 9.5 Impact of Vss Package—Pin Placement on Noise Modeling
  • 9.6 Summary
  • 10 — Conclusions
  • 11 — Discussion and Future Work
  • 11.1 BiCMOS Outputs Simultaneous Switching Noise..
  • 11.2 Use of Substrate-Taps to Reduce SSN
  • 11.3 SSNS Architecture Improvement
  • Appendix A
  • Appendix B
  • Appendix C
  • Appendix D
  • Appendix E
  • References
  • About the Authors
  • 5.5 Three—Dimensional Modeling Technique
  • 5.6 Comparison Between Measurement and Simulations.
  • 5.7 Full—Wave Analysis of a Periodically Perforated Structure
  • 5.8 Summary
  • 6 — Dynamic Noise Immunity, and Skewing/Damping SSN Waveform
  • 6.1 Introduction
  • 6.2 Driver Switching Noise and Receiver Noise Immunity
  • 6.3 Effects of Skewing Output Drivers
  • 6.4 Trade—offs in Using Damping Resistors
  • 6.5 Summary
  • 7 — Application Specific Output Drivers to Reduce SSN
  • 7.1 Introduction
  • 7.2 CMOS Output Driver Switching Current Components
  • 7.3 Current Controlled Output Drivers
  • 7.4 Controlled Slew Rate Output Drivers
  • 7.5 Summary
  • 8 — SSN Simulator Architecture
  • 8.1 Introduction
  • 8.2 SSNS Architecture
  • 8.3 “Less” Modeling for MCM Vss Connections
  • 8.4 Simultaneous Switching Noise Calculation for CMOS MCM123 8.5 Summary
  • 9 — Signal Conductors over a Noisy Reference Plane
  • 9.1 Introduction and Motivation
  • 1 — Introduction
  • 1.1 Background
  • 1.2 Introduction
  • 2 — Packaged/Scaled CMOS Devices
  • 2.1 Introduction
  • 2.2 Interconnect Scaling
  • 2.3 Delays with Driver/Interconnect Scaling
  • 2.4 Summary
  • 3 — Methods of Calculating Simultaneous Switching Noise
  • 3.1 Introduction
  • 3.2 Theory and Modeling
  • 3.3 Ground Noise and Vss Pad-Pin Connection Calculation.
  • 3.4 Results
  • 3.5 Behavior of Simultaneous Switching Noise with Scaling.
  • 3.6 Summary
  • 4 — Power Distribution Inductance Modeling
  • 4.1 Introduction
  • 4.2 Mathematical Formulation of UALGRL
  • 4.3 Effective Inductance “Lvss” Modeling
  • 4.4 Reference Plane Inductance Network Calculation.
  • 4.5 Results
  • 4.6 Summary
  • 5 — Signal Conductors over a Perforated Reference Plane
  • 5.1 Introduction
  • 5.2 Impact of Reference Plane Openings for Stripline Geometries
  • 5.3 Connector Characterization Using S—Parameter Measurement Techniques
  • 5.4 Modeling Using Two Dimensional (TEM) Approximation