Pulsed and Pulsed Bias Sputtering Principles and Applications
Diffusion Barrier Stack - 5 nm -3 nm -2 nm :. . . -. . . . : . . O. 21-lm Figure 2: Schematic representing a cross-sectional view of the topography that is encountered in the processing of integrated circuits. (Not to scale) these sub-micron sized features is depicted in Fig. 2. The role of the diff...
| Main Authors: | , |
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| Format: | eBook |
| Language: | English |
| Published: |
New York, NY
Springer US
2003, 2003
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| Edition: | 1st ed. 2003 |
| Subjects: | |
| Online Access: | |
| Collection: | Springer Book Archives -2004 - Collection details see MPG.ReNa |
Table of Contents:
- 1 Introduction
- 2 Basic Plasma Phenomenon
- 3 Plasma Sources Used for Sputter Deposition
- 4 Response of a Plasma to an Applied Bias
- 5 Sinusoidal Waveform
- 6 Pulsed Waveform
- 7 Application Of A Pulsed Waveform to a Target: Pulsed Reactive Sputtering
- 8 Application of a Pulsed Waveform to a Substrate: Pulsed Bias Sputtering
- 9 Conclusions and Future Directions
- References