Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and conti...

Full description

Bibliographic Details
Main Authors: Tan, Cher Ming, Li, Wei (Author), Gan, Zhenghao (Author), Hou, Yuejin (Author)
Format: eBook
Language:English
Published: London Springer London 2011, 2011
Edition:1st ed. 2011
Series:Springer Series in Reliability Engineering
Subjects:
Online Access:
Collection: Springer eBooks 2005- - Collection details see MPG.ReNa
LEADER 03601nmm a2200409 u 4500
001 EB000357594
003 EBX01000000000000000210646
005 00000000000000.0
007 cr|||||||||||||||||||||
008 130626 ||| eng
020 |a 9780857293107 
100 1 |a Tan, Cher Ming 
245 0 0 |a Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections  |h Elektronische Ressource  |c by Cher Ming Tan, Wei Li, Zhenghao Gan, Yuejin Hou 
250 |a 1st ed. 2011 
260 |a London  |b Springer London  |c 2011, 2011 
300 |a VIII, 152 p  |b online resource 
505 0 |a 1. Introduction -- 2. Development of Physics-based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress Induced Voiding -- 3. Introduction and General Theory of Finite Element Method -- 4. Finite Element Method for Electromigration Study -- 5. Finite Element Method for Stress Induced Voiding -- 6. Finite Element Method for Dielectric Reliability 
653 |a Security Science and Technology 
653 |a Electronics and Microelectronics, Instrumentation 
653 |a Computational intelligence 
653 |a Security systems 
653 |a Computational Intelligence 
653 |a Optical Materials 
653 |a Electronics 
653 |a Optical materials 
653 |a Differential Equations 
653 |a Differential equations 
700 1 |a Li, Wei  |e [author] 
700 1 |a Gan, Zhenghao  |e [author] 
700 1 |a Hou, Yuejin  |e [author] 
041 0 7 |a eng  |2 ISO 639-2 
989 |b Springer  |a Springer eBooks 2005- 
490 0 |a Springer Series in Reliability Engineering 
028 5 0 |a 10.1007/978-0-85729-310-7 
856 4 0 |u https://doi.org/10.1007/978-0-85729-310-7?nosfx=y  |x Verlag  |3 Volltext 
082 0 |a 621 
520 |a Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs’ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader’s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability