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2005 International Symposium on Electronics Materials and Packaging

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2005
Subjects:
Components, Circuits, Devices And Systems; Engineered Materials, Dielectrics And Plasmas
Online Access:
https://ieeexplore.ieee.org/servlet/opac?punumber=...
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
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ISBN:1424401070
9781509099559

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