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2005 6th International Conference on Electronic Packaging Technology

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2005
Subjects:
Engineered Materials, Dielectrics And Plasmas; Components, Circuits, Devices And Systems
Online Access:
https://ieeexplore.ieee.org/servlet/opac?punumber=...
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
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ISBN:9781509099368
0780394496

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