MPG.eBooks - Description: 2007 International Conference on Electronic Materials and Packaging

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Bibliographic Details
Format:	eBook
Published:	New York The Institute of Electrical and Electronics Engineers, Inc. 2007
Subjects:	Engineered Materials, Dielectrics And Plasmas; Components, Circuits, Devices And Systems
Online Access:	https://ieeexplore.ieee.org/servlet/opac?punumber=...
Collection:	IEEE Conference Proceedings - Collection details see MPG.ReNa

Description
ISBN:	9781509089963 9781424419098