9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings.
| Format: | eBook |
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| Published: |
New York
The Institute of Electrical and Electronics Engineers, Inc.
2004
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| Collection: | IEEE Conference Proceedings - Collection details see MPG.ReNa |
| ISBN: | 0780384369 |
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