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2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2002
Subjects:
Components, Circuits, Devices And Systems; Engineered Materials, Dielectrics And Plasmas
Online Access:
https://ieeexplore.ieee.org/servlet/opac?punumber=...
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
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ISBN:0780374347

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