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2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Bibliographic Details
Format: eBook
Published: New York The Institute of Electrical and Electronics Engineers, Inc. 2008
Subjects:
Computing And Processing; Communication, Networking And Broadcast Technologies; Components, Circuits, Devices And Systems
Online Access:
https://ieeexplore.ieee.org/servlet/opac?punumber=...
Collection: IEEE Conference Proceedings - Collection details see MPG.ReNa
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ISBN:9782355000065

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